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Extreme Temperature Test

Extreme Temperature Test | Upscaling


Retronix – Extreme Temperature Test:

Temperature extremes can significantly alter the mechanical and electrical properties of a component, such as brittleness of ICs, electrical conductivity and frequencies. Such extremes can lead to early life failure of electrical systems and unreliable operations.

For industries operating in the High reliability sectors such as Defence, Aerospace, Oil & Gas many electrical components while inexpensive to purchase, may be expensive to replace; as the systems they are applied on are remote and the downtime expensive; therefore for such critical applications; temperature test is more important.

The Retronix Test Temperature system determines how ICs would cope with extreme temperatures. The system simulates:

  • Temperature Range: -55oc to +125oc
  • Temperature Accuracy: ± 0.1oc to ± 0.6oc
  • Rate of change: (According to IEC60068-3-5)
  • 5.3oc/min Average Heating in Empty Chamber
  • 4.2oc/min Average Cooling in Empty Chamber

Retronix Temperature test system fully conforms to the MIL-STD 883 standard and this covers environmental testing of components stated as a requirement. The report provided by Retronix contains physical component specifications, the length of true measurement and the overall result of the temperature test.

OPTION 1: SAMPLE TEST

This option will include selecting a sample of ICs from each batch and conduct a temperature test, while simultaneously performing an electrical check. If test reports are the same across the full temperature cycle then that particular IC will be classified as PASS. If any section of the test has a different result from another then the IC will be classified FAIL.

Process :

Step 1: IC is tested at Room Temperature

Step 2: The Chamber is cooled down to -55°c ; a second test is performed.

Step 3: The chamber is heated to +125°c ; a third test is performed.

Step 4: The chamber is then set at room temperature; a fourth test is performed.

Step 5: All 4 test results are then compared.

Curve Trace Test Match

Curve Trace Test Mismatch

OPTION 2: SOAK TEST

The soak test is the same test as the previous “Sample Test” but the one difference is that when the chamber reaches the extreme temperature (-55°c or +125°c) it stays at that temperature for a pre agreed time to allow the component to soak at that temp before being tested.

Process:

Step 1: IC is tested at Room Temperature

Step 2: The Chamber is cooled down to -55°c ; IC left in the chamber for an agreed time; a second test is performed.

Step 3: The chamber is heated to +125°c ; IC left in the chamber for an agreed time; a third test is performed.

Step 4: The chamber is then set at room temperature; a fourth test is performed.

Step 5: All 4 test results are then compared.

Temperature Test - Agreed Time in Chamber

OPTION 3: EXPRESS TEST

The Express Test Option offered by Retronix is conducted on all IC’s and not just a sample; each IC is subjected to Extreme Temperatures by being held in Cold Storage (-55°c) and Hot storage (+125°c) prior to Test Chamber Insertion. Holding the components in these extreme temp zones prior to Test greatly decreases the time that a sample test cycle would take. Once the Test Chamber temp range has been fully achieved then we inset the device and test the device’s electrical characteristics in that environment. We compare these against ambient test results and produce a report that encompasses these results and the visual inspection results pre/ post storage and test.

Fast & Efficient.

Temperature Test - Express Option