Decapsulation (De Cap)

Decapsulation of Components Reveals the Internal Die Structure

Component Before De-Capsulation

One of the most difficult areas of a component to counterfeit and copy is the internal die structure. Decapping removes the body of the device through a safely controlled chemical process exposes the actual die structure of the component, including the bond wire in many cases. Although decapsulation is a destructive test, under high powered microscopy, we can normally view critical information on the die, such as the manufacturers name, the manufacturers logo and part number etc.

Die Structure After De-Cap

In extreme situations where the dies has been copied, the same manufacturers die has been copied or parts have been remarked to make them look like upgraded specification parts, we can determine specific areas of the dies that will correspond only with the original die.